initial commit

1 files changed, 56 insertions, 0 deletions

diff --git a/footprints.pretty/MAX98357.kicad_mod b/footprints.pretty/MAX98357.kicad_mod
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+++ b/footprints.pretty/MAX98357.kicad_mod
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+(module MAX98357 (layer F.Cu) (tedit 5C49C5D5)
+  (descr "16-Lead Plastic Quad Flat, No Lead Package (NG) - 3x3x0.9 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf)")
+  (tags "QFN 0.5")
+  (attr smd)
+  (fp_text reference REF** (at 0 -2.85) (layer F.SilkS)
+    (effects (font (size 1 1) (thickness 0.15)))
+  )
+  (fp_text value MAX98357 (at 0 2.85) (layer F.Fab)
+    (effects (font (size 1 1) (thickness 0.15)))
+  )
+  (fp_line (start -0.5 -1.5) (end 1.5 -1.5) (layer F.Fab) (width 0.15))
+  (fp_line (start 1.5 -1.5) (end 1.5 1.5) (layer F.Fab) (width 0.15))
+  (fp_line (start 1.5 1.5) (end -1.5 1.5) (layer F.Fab) (width 0.15))
+  (fp_line (start -1.5 1.5) (end -1.5 -0.5) (layer F.Fab) (width 0.15))
+  (fp_line (start -1.5 -0.5) (end -0.5 -1.5) (layer F.Fab) (width 0.15))
+  (fp_line (start -2.1 -2.1) (end -2.1 2.1) (layer F.CrtYd) (width 0.05))
+  (fp_line (start 2.1 -2.1) (end 2.1 2.1) (layer F.CrtYd) (width 0.05))
+  (fp_line (start -2.1 -2.1) (end 2.1 -2.1) (layer F.CrtYd) (width 0.05))
+  (fp_line (start -2.1 2.1) (end 2.1 2.1) (layer F.CrtYd) (width 0.05))
+  (fp_line (start 1.625 -1.625) (end 1.625 -1.125) (layer F.SilkS) (width 0.15))
+  (fp_line (start -1.625 1.625) (end -1.625 1.125) (layer F.SilkS) (width 0.15))
+  (fp_line (start 1.625 1.625) (end 1.625 1.125) (layer F.SilkS) (width 0.15))
+  (fp_line (start -1.625 -1.625) (end -1.125 -1.625) (layer F.SilkS) (width 0.15))
+  (fp_line (start -1.625 1.625) (end -1.125 1.625) (layer F.SilkS) (width 0.15))
+  (fp_line (start 1.625 1.625) (end 1.125 1.625) (layer F.SilkS) (width 0.15))
+  (fp_line (start 1.625 -1.625) (end 1.125 -1.625) (layer F.SilkS) (width 0.15))
+  (pad 1 smd oval (at -1.475 -0.75) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask))
+  (pad 2 smd oval (at -1.475 -0.25) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask))
+  (pad 3 smd oval (at -1.475 0.25) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask))
+  (pad 4 smd oval (at -1.475 0.75) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask))
+  (pad 5 smd oval (at -0.75 1.475 90) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask))
+  (pad 6 smd oval (at -0.25 1.475 90) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask))
+  (pad 7 smd oval (at 0.25 1.475 90) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask))
+  (pad 8 smd oval (at 0.75 1.475 90) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask))
+  (pad 9 smd oval (at 1.475 0.75) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask))
+  (pad 10 smd oval (at 1.475 0.25) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask))
+  (pad 11 smd oval (at 1.475 -0.25) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask))
+  (pad 12 smd oval (at 1.475 -0.75) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask))
+  (pad 13 smd oval (at 0.75 -1.475 90) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask))
+  (pad 14 smd oval (at 0.25 -1.475 90) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask))
+  (pad 15 smd oval (at -0.25 -1.475 90) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask))
+  (pad 16 smd oval (at -0.75 -1.475 90) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask))
+  (pad 17 smd rect (at 0.3075 0.3075) (size 0.615 0.615) (layers F.Cu F.Paste F.Mask)
+    (solder_paste_margin_ratio -0.2))
+  (pad 17 smd rect (at 0.3075 -0.3075) (size 0.615 0.615) (layers F.Cu F.Paste F.Mask)
+    (solder_paste_margin_ratio -0.2))
+  (pad 17 smd rect (at -0.3075 0.3075) (size 0.615 0.615) (layers F.Cu F.Paste F.Mask)
+    (solder_paste_margin_ratio -0.2))
+  (pad 17 smd rect (at -0.3075 -0.3075) (size 0.615 0.615) (layers F.Cu F.Paste F.Mask)
+    (solder_paste_margin_ratio -0.2))
+  (model Housings_DFN_QFN.3dshapes/QFN-16-1EP_3x3mm_Pitch0.5mm.wrl
+    (at (xyz 0 0 0))
+    (scale (xyz 1 1 1))
+    (rotate (xyz 0 0 0))
+  )
+)