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authorUros Majstorovic <majstor@majstor.org>2024-01-22 18:46:30 +0100
committerUros Majstorovic <majstor@majstor.org>2024-01-22 18:46:30 +0100
commit4aab0c3ef5f4aaee73ba2767c25f8b3228d963b4 (patch)
treed82cb1f5ff791e09bfd972ac002a9eea7ce78811 /hw/footprints.pretty/TE_SODIMM_DDR3-2013289.kicad_mod
parent7109450fd6b3b57910f39c0f9373713337cba75c (diff)
Toradex Verdin iMX8M Plus module support; modularize wifi; flash LED driver; mic amp for headsets; mute switch; new cam interface; ext buttons;
Diffstat (limited to 'hw/footprints.pretty/TE_SODIMM_DDR3-2013289.kicad_mod')
-rw-r--r--hw/footprints.pretty/TE_SODIMM_DDR3-2013289.kicad_mod8
1 files changed, 4 insertions, 4 deletions
diff --git a/hw/footprints.pretty/TE_SODIMM_DDR3-2013289.kicad_mod b/hw/footprints.pretty/TE_SODIMM_DDR3-2013289.kicad_mod
index f6a500e..01743f0 100644
--- a/hw/footprints.pretty/TE_SODIMM_DDR3-2013289.kicad_mod
+++ b/hw/footprints.pretty/TE_SODIMM_DDR3-2013289.kicad_mod
@@ -1,11 +1,11 @@
-(module TE_SODIMMDDR3-2013289 (layer F.Cu) (tedit 63545F1B)
+(module TE_SODIMM_DDR3-2013289 (layer F.Cu) (tedit 64E6A4E4)
(descr "DDR 3 SODIMM Memory Socket - TE P/N 2013289")
(tags "DDR RAM SODIMM")
(attr smd)
(fp_text reference REF** (at 0 -7.05) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
- (fp_text value TE_SODIMM_DDR3-2013289 (at 0 7.1) (layer F.Fab)
+ (fp_text value TE_SODIMM_DDR3-2013289 (at 0 2.15) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -20.85 -42) (end 20.75 -42) (layer Dwgs.User) (width 0.12))
@@ -42,8 +42,8 @@
(fp_arc (start -21.85 -42) (end -22.85 -42) (angle -180) (layer Dwgs.User) (width 0.12))
(pad "" np_thru_hole circle (at -33.4 0) (size 1.6 1.6) (drill 1.6) (layers *.Cu *.Mask))
(pad "" np_thru_hole circle (at 33.4 0) (size 1.1 1.1) (drill 1.1) (layers *.Cu *.Mask))
- (pad "" smd rect (at 32.8 -12) (size 3.5 4.6) (layers F.Cu F.Paste F.Mask))
- (pad "" smd rect (at -32.8 -12) (size 3.5 4.6) (layers F.Cu F.Paste F.Mask))
+ (pad MP smd rect (at 32.8 -12) (size 3.5 4.6) (layers F.Cu F.Paste F.Mask))
+ (pad MP smd rect (at -32.8 -12) (size 3.5 4.6) (layers F.Cu F.Paste F.Mask))
(pad 1 smd rect (at -31.65 4.1) (size 0.35 2) (layers F.Cu F.Paste F.Mask))
(pad 3 smd rect (at -31.05 4.1) (size 0.35 2) (layers F.Cu F.Paste F.Mask))
(pad 5 smd rect (at -30.45 4.1) (size 0.35 2) (layers F.Cu F.Paste F.Mask))