summaryrefslogtreecommitdiff
path: root/footprints.pretty/QFN-24-1EP_4x4mm_Pitch0.5mm.kicad_mod
diff options
context:
space:
mode:
authorUros Majstorovic <majstor@majstor.org>2019-08-12 13:13:31 +0200
committerUros Majstorovic <majstor@majstor.org>2019-08-12 13:13:31 +0200
commit629511a4d61e8a7b06576246f85ad8368a2edba4 (patch)
treea4e8e347c932c54696496407aa2375723dbbc0fa /footprints.pretty/QFN-24-1EP_4x4mm_Pitch0.5mm.kicad_mod
parente2dc536c7ed94dadd58c51638f9b44aa58bedb3e (diff)
upgrade to kicad 5; fixed footprints
Diffstat (limited to 'footprints.pretty/QFN-24-1EP_4x4mm_Pitch0.5mm.kicad_mod')
-rw-r--r--footprints.pretty/QFN-24-1EP_4x4mm_Pitch0.5mm.kicad_mod64
1 files changed, 0 insertions, 64 deletions
diff --git a/footprints.pretty/QFN-24-1EP_4x4mm_Pitch0.5mm.kicad_mod b/footprints.pretty/QFN-24-1EP_4x4mm_Pitch0.5mm.kicad_mod
deleted file mode 100644
index 51b6321..0000000
--- a/footprints.pretty/QFN-24-1EP_4x4mm_Pitch0.5mm.kicad_mod
+++ /dev/null
@@ -1,64 +0,0 @@
-(module QFN-24-1EP_4x4mm_Pitch0.5mm (layer F.Cu) (tedit 5C91A869)
- (descr "24-Lead Plastic Quad Flat, No Lead Package (MJ) - 4x4x0.9 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf)")
- (tags "QFN 0.5")
- (attr smd)
- (fp_text reference REF** (at 0 -3.375) (layer F.SilkS)
- (effects (font (size 1 1) (thickness 0.15)))
- )
- (fp_text value QFN-24-1EP_4x4mm_Pitch0.5mm (at 0 3.375) (layer F.Fab)
- (effects (font (size 1 1) (thickness 0.15)))
- )
- (fp_line (start -1 -2) (end 2 -2) (layer F.Fab) (width 0.15))
- (fp_line (start 2 -2) (end 2 2) (layer F.Fab) (width 0.15))
- (fp_line (start 2 2) (end -2 2) (layer F.Fab) (width 0.15))
- (fp_line (start -2 2) (end -2 -1) (layer F.Fab) (width 0.15))
- (fp_line (start -2 -1) (end -1 -2) (layer F.Fab) (width 0.15))
- (fp_line (start -2.65 -2.65) (end -2.65 2.65) (layer F.CrtYd) (width 0.05))
- (fp_line (start 2.65 -2.65) (end 2.65 2.65) (layer F.CrtYd) (width 0.05))
- (fp_line (start -2.65 -2.65) (end 2.65 -2.65) (layer F.CrtYd) (width 0.05))
- (fp_line (start -2.65 2.65) (end 2.65 2.65) (layer F.CrtYd) (width 0.05))
- (fp_line (start 2.15 -2.15) (end 2.15 -1.625) (layer F.SilkS) (width 0.15))
- (fp_line (start -2.15 2.15) (end -2.15 1.625) (layer F.SilkS) (width 0.15))
- (fp_line (start 2.15 2.15) (end 2.15 1.625) (layer F.SilkS) (width 0.15))
- (fp_line (start -2.15 -2.15) (end -1.625 -2.15) (layer F.SilkS) (width 0.15))
- (fp_line (start -2.15 2.15) (end -1.625 2.15) (layer F.SilkS) (width 0.15))
- (fp_line (start 2.15 2.15) (end 1.625 2.15) (layer F.SilkS) (width 0.15))
- (fp_line (start 2.15 -2.15) (end 1.625 -2.15) (layer F.SilkS) (width 0.15))
- (pad 1 smd oval (at -1.95 -1.25) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask))
- (pad 2 smd oval (at -1.95 -0.75) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask))
- (pad 3 smd oval (at -1.95 -0.25) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask))
- (pad 4 smd oval (at -1.95 0.25) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask))
- (pad 5 smd oval (at -1.95 0.75) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask))
- (pad 6 smd oval (at -1.95 1.25) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask))
- (pad 7 smd oval (at -1.25 1.95 90) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask))
- (pad 8 smd oval (at -0.75 1.95 90) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask))
- (pad 9 smd oval (at -0.25 1.95 90) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask))
- (pad 10 smd oval (at 0.25 1.95 90) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask))
- (pad 11 smd oval (at 0.75 1.95 90) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask))
- (pad 12 smd oval (at 1.25 1.95 90) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask))
- (pad 13 smd oval (at 1.95 1.25) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask))
- (pad 14 smd oval (at 1.95 0.75) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask))
- (pad 15 smd oval (at 1.95 0.25) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask))
- (pad 16 smd oval (at 1.95 -0.25) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask))
- (pad 17 smd oval (at 1.95 -0.75) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask))
- (pad 18 smd oval (at 1.95 -1.25) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask))
- (pad 19 smd oval (at 1.25 -1.95 90) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask))
- (pad 20 smd oval (at 0.75 -1.95 90) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask))
- (pad 21 smd oval (at 0.25 -1.95 90) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask))
- (pad 22 smd oval (at -0.25 -1.95 90) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask))
- (pad 23 smd oval (at -0.75 -1.95 90) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask))
- (pad 24 smd oval (at -1.25 -1.95 90) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask))
- (pad 25 smd rect (at 0.65 0.65) (size 1.3 1.3) (layers F.Cu F.Paste F.Mask)
- (solder_paste_margin_ratio -0.2))
- (pad 25 smd rect (at 0.65 -0.65) (size 1.3 1.3) (layers F.Cu F.Paste F.Mask)
- (solder_paste_margin_ratio -0.2))
- (pad 25 smd rect (at -0.65 0.65) (size 1.3 1.3) (layers F.Cu F.Paste F.Mask)
- (solder_paste_margin_ratio -0.2))
- (pad 25 smd rect (at -0.65 -0.65) (size 1.3 1.3) (layers F.Cu F.Paste F.Mask)
- (solder_paste_margin_ratio -0.2))
- (model Housings_DFN_QFN.3dshapes/QFN-24-1EP_4x4mm_Pitch0.5mm.wrl
- (at (xyz 0 0 0))
- (scale (xyz 1 1 1))
- (rotate (xyz 0 0 0))
- )
-)