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author | Uros Majstorovic <majstor@majstor.org> | 2019-04-10 00:46:00 +0200 |
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committer | Uros Majstorovic <majstor@majstor.org> | 2019-04-10 00:46:00 +0200 |
commit | f6b84e1a5fa570d8743eb4493ddc66776ceb932f (patch) | |
tree | f8026531a7d0c079c6470d1ad14b2067348c09dc /footprints.pretty/QFN-24-1EP_4x4mm_Pitch0.5mm.kicad_mod |
initial commit
Diffstat (limited to 'footprints.pretty/QFN-24-1EP_4x4mm_Pitch0.5mm.kicad_mod')
-rw-r--r-- | footprints.pretty/QFN-24-1EP_4x4mm_Pitch0.5mm.kicad_mod | 64 |
1 files changed, 64 insertions, 0 deletions
diff --git a/footprints.pretty/QFN-24-1EP_4x4mm_Pitch0.5mm.kicad_mod b/footprints.pretty/QFN-24-1EP_4x4mm_Pitch0.5mm.kicad_mod new file mode 100644 index 0000000..51b6321 --- /dev/null +++ b/footprints.pretty/QFN-24-1EP_4x4mm_Pitch0.5mm.kicad_mod @@ -0,0 +1,64 @@ +(module QFN-24-1EP_4x4mm_Pitch0.5mm (layer F.Cu) (tedit 5C91A869) + (descr "24-Lead Plastic Quad Flat, No Lead Package (MJ) - 4x4x0.9 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf)") + (tags "QFN 0.5") + (attr smd) + (fp_text reference REF** (at 0 -3.375) (layer F.SilkS) + (effects (font (size 1 1) (thickness 0.15))) + ) + (fp_text value QFN-24-1EP_4x4mm_Pitch0.5mm (at 0 3.375) (layer F.Fab) + (effects (font (size 1 1) (thickness 0.15))) + ) + (fp_line (start -1 -2) (end 2 -2) (layer F.Fab) (width 0.15)) + (fp_line (start 2 -2) (end 2 2) (layer F.Fab) (width 0.15)) + (fp_line (start 2 2) (end -2 2) (layer F.Fab) (width 0.15)) + (fp_line (start -2 2) (end -2 -1) (layer F.Fab) (width 0.15)) + (fp_line (start -2 -1) (end -1 -2) (layer F.Fab) (width 0.15)) + (fp_line (start -2.65 -2.65) (end -2.65 2.65) (layer F.CrtYd) (width 0.05)) + (fp_line (start 2.65 -2.65) (end 2.65 2.65) (layer F.CrtYd) (width 0.05)) + (fp_line (start -2.65 -2.65) (end 2.65 -2.65) (layer F.CrtYd) (width 0.05)) + (fp_line (start -2.65 2.65) (end 2.65 2.65) (layer F.CrtYd) (width 0.05)) + (fp_line (start 2.15 -2.15) (end 2.15 -1.625) (layer F.SilkS) (width 0.15)) + (fp_line (start -2.15 2.15) (end -2.15 1.625) (layer F.SilkS) (width 0.15)) + (fp_line (start 2.15 2.15) (end 2.15 1.625) (layer F.SilkS) (width 0.15)) + (fp_line (start -2.15 -2.15) (end -1.625 -2.15) (layer F.SilkS) (width 0.15)) + (fp_line (start -2.15 2.15) (end -1.625 2.15) (layer F.SilkS) (width 0.15)) + (fp_line (start 2.15 2.15) (end 1.625 2.15) (layer F.SilkS) (width 0.15)) + (fp_line (start 2.15 -2.15) (end 1.625 -2.15) (layer F.SilkS) (width 0.15)) + (pad 1 smd oval (at -1.95 -1.25) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask)) + (pad 2 smd oval (at -1.95 -0.75) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask)) + (pad 3 smd oval (at -1.95 -0.25) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask)) + (pad 4 smd oval (at -1.95 0.25) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask)) + (pad 5 smd oval (at -1.95 0.75) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask)) + (pad 6 smd oval (at -1.95 1.25) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask)) + (pad 7 smd oval (at -1.25 1.95 90) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask)) + (pad 8 smd oval (at -0.75 1.95 90) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask)) + (pad 9 smd oval (at -0.25 1.95 90) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask)) + (pad 10 smd oval (at 0.25 1.95 90) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask)) + (pad 11 smd oval (at 0.75 1.95 90) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask)) + (pad 12 smd oval (at 1.25 1.95 90) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask)) + (pad 13 smd oval (at 1.95 1.25) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask)) + (pad 14 smd oval (at 1.95 0.75) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask)) + (pad 15 smd oval (at 1.95 0.25) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask)) + (pad 16 smd oval (at 1.95 -0.25) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask)) + (pad 17 smd oval (at 1.95 -0.75) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask)) + (pad 18 smd oval (at 1.95 -1.25) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask)) + (pad 19 smd oval (at 1.25 -1.95 90) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask)) + (pad 20 smd oval (at 0.75 -1.95 90) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask)) + (pad 21 smd oval (at 0.25 -1.95 90) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask)) + (pad 22 smd oval (at -0.25 -1.95 90) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask)) + (pad 23 smd oval (at -0.75 -1.95 90) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask)) + (pad 24 smd oval (at -1.25 -1.95 90) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask)) + (pad 25 smd rect (at 0.65 0.65) (size 1.3 1.3) (layers F.Cu F.Paste F.Mask) + (solder_paste_margin_ratio -0.2)) + (pad 25 smd rect (at 0.65 -0.65) (size 1.3 1.3) (layers F.Cu F.Paste F.Mask) + (solder_paste_margin_ratio -0.2)) + (pad 25 smd rect (at -0.65 0.65) (size 1.3 1.3) (layers F.Cu F.Paste F.Mask) + (solder_paste_margin_ratio -0.2)) + (pad 25 smd rect (at -0.65 -0.65) (size 1.3 1.3) (layers F.Cu F.Paste F.Mask) + (solder_paste_margin_ratio -0.2)) + (model Housings_DFN_QFN.3dshapes/QFN-24-1EP_4x4mm_Pitch0.5mm.wrl + (at (xyz 0 0 0)) + (scale (xyz 1 1 1)) + (rotate (xyz 0 0 0)) + ) +) |