HW REV 3.0

1 files changed, 38 insertions, 0 deletions

diff --git a/hw/footprints.pretty/TDFN-10-1EP_2x2.5mm_P0.4mm_EP1.3x1.4mm_ThermalVias.kicad_mod b/hw/footprints.pretty/TDFN-10-1EP_2x2.5mm_P0.4mm_EP1.3x1.4mm_ThermalVias.kicad_mod
new file mode 100644
index 0000000..a89be2a
--- /dev/null
+++ b/hw/footprints.pretty/TDFN-10-1EP_2x2.5mm_P0.4mm_EP1.3x1.4mm_ThermalVias.kicad_mod
@@ -0,0 +1,38 @@
+(module TDFN-10-1EP_2x2.5mm_P0.4mm_EP1.3x1.4mm_ThermalVias (layer F.Cu) (tedit 613C1A99)
+  (fp_text reference REF** (at 0 -2.05) (layer F.SilkS)
+    (effects (font (size 1 1) (thickness 0.15)))
+  )
+  (fp_text value TDFN-10-1EP_2x2.5mm_P0.4mm_EP1.3x1.4mm_ThermalVias (at 0 2.1) (layer F.Fab)
+    (effects (font (size 1 1) (thickness 0.15)))
+  )
+  (fp_line (start -1.62 1.25) (end 1.62 1.25) (layer F.CrtYd) (width 0.05))
+  (fp_line (start 1.62 -1.25) (end -1.62 -1.25) (layer F.CrtYd) (width 0.05))
+  (fp_line (start -1 1.1) (end 1 1.1) (layer F.SilkS) (width 0.12))
+  (fp_line (start -1.25 1) (end -1.25 -0.5) (layer F.Fab) (width 0.1))
+  (fp_line (start 0 -1.1) (end 1 -1.1) (layer F.SilkS) (width 0.12))
+  (fp_line (start -1.62 -1.25) (end -1.62 1.25) (layer F.CrtYd) (width 0.05))
+  (fp_line (start 1.62 1.25) (end 1.62 -1.25) (layer F.CrtYd) (width 0.05))
+  (fp_line (start 1.25 1) (end -1.25 1) (layer F.Fab) (width 0.1))
+  (fp_line (start -0.75 -1) (end 1.25 -1) (layer F.Fab) (width 0.1))
+  (fp_line (start 1.25 -1) (end 1.25 1) (layer F.Fab) (width 0.1))
+  (fp_line (start -1.25 -0.5) (end -0.75 -1) (layer F.Fab) (width 0.1))
+  (fp_text user %R (at 0 0) (layer F.Fab)
+    (effects (font (size 0.5 0.5) (thickness 0.08)))
+  )
+  (pad 3 smd roundrect (at -1.225 0) (size 0.65 0.2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
+  (pad 10 smd roundrect (at 1.225 -0.8) (size 0.65 0.2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
+  (pad 8 smd roundrect (at 1.225 0) (size 0.65 0.2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
+  (pad 11 thru_hole circle (at 0 0.4) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
+  (pad 11 thru_hole circle (at 0 -0.4) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
+  (pad 4 smd roundrect (at -1.225 0.4) (size 0.65 0.2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
+  (pad 9 smd roundrect (at 1.225 -0.4) (size 0.65 0.2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
+  (pad "" smd roundrect (at 0 -0.35) (size 1.1 0.5) (layers F.Paste) (roundrect_rratio 0.25))
+  (pad 11 smd rect (at 0 0) (size 1.3 1.4) (layers F.Cu F.Mask))
+  (pad 2 smd roundrect (at -1.225 -0.4) (size 0.65 0.2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
+  (pad "" smd roundrect (at 0 0.35) (size 1.1 0.5) (layers F.Paste) (roundrect_rratio 0.25))
+  (pad 5 smd roundrect (at -1.225 0.8) (size 0.65 0.2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
+  (pad 7 smd roundrect (at 1.225 0.4) (size 0.65 0.2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
+  (pad 11 smd rect (at 0 0) (size 0.6 1.4) (layers B.Cu))
+  (pad 1 smd roundrect (at -1.225 -0.8) (size 0.65 0.2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
+  (pad 6 smd roundrect (at 1.225 0.8) (size 0.65 0.2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
+)