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(module MAX98357 (layer F.Cu) (tedit 5C49C5D5)
(descr "16-Lead Plastic Quad Flat, No Lead Package (NG) - 3x3x0.9 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "QFN 0.5")
(attr smd)
(fp_text reference REF** (at 0 -2.85) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value MAX98357 (at 0 2.85) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -0.5 -1.5) (end 1.5 -1.5) (layer F.Fab) (width 0.15))
(fp_line (start 1.5 -1.5) (end 1.5 1.5) (layer F.Fab) (width 0.15))
(fp_line (start 1.5 1.5) (end -1.5 1.5) (layer F.Fab) (width 0.15))
(fp_line (start -1.5 1.5) (end -1.5 -0.5) (layer F.Fab) (width 0.15))
(fp_line (start -1.5 -0.5) (end -0.5 -1.5) (layer F.Fab) (width 0.15))
(fp_line (start -2.1 -2.1) (end -2.1 2.1) (layer F.CrtYd) (width 0.05))
(fp_line (start 2.1 -2.1) (end 2.1 2.1) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.1 -2.1) (end 2.1 -2.1) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.1 2.1) (end 2.1 2.1) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.625 -1.625) (end 1.625 -1.125) (layer F.SilkS) (width 0.15))
(fp_line (start -1.625 1.625) (end -1.625 1.125) (layer F.SilkS) (width 0.15))
(fp_line (start 1.625 1.625) (end 1.625 1.125) (layer F.SilkS) (width 0.15))
(fp_line (start -1.625 -1.625) (end -1.125 -1.625) (layer F.SilkS) (width 0.15))
(fp_line (start -1.625 1.625) (end -1.125 1.625) (layer F.SilkS) (width 0.15))
(fp_line (start 1.625 1.625) (end 1.125 1.625) (layer F.SilkS) (width 0.15))
(fp_line (start 1.625 -1.625) (end 1.125 -1.625) (layer F.SilkS) (width 0.15))
(pad 1 smd oval (at -1.475 -0.75) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask))
(pad 2 smd oval (at -1.475 -0.25) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask))
(pad 3 smd oval (at -1.475 0.25) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask))
(pad 4 smd oval (at -1.475 0.75) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask))
(pad 5 smd oval (at -0.75 1.475 90) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask))
(pad 6 smd oval (at -0.25 1.475 90) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask))
(pad 7 smd oval (at 0.25 1.475 90) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask))
(pad 8 smd oval (at 0.75 1.475 90) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask))
(pad 9 smd oval (at 1.475 0.75) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask))
(pad 10 smd oval (at 1.475 0.25) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask))
(pad 11 smd oval (at 1.475 -0.25) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask))
(pad 12 smd oval (at 1.475 -0.75) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask))
(pad 13 smd oval (at 0.75 -1.475 90) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask))
(pad 14 smd oval (at 0.25 -1.475 90) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask))
(pad 15 smd oval (at -0.25 -1.475 90) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask))
(pad 16 smd oval (at -0.75 -1.475 90) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask))
(pad 17 smd rect (at 0.3075 0.3075) (size 0.615 0.615) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin_ratio -0.2))
(pad 17 smd rect (at 0.3075 -0.3075) (size 0.615 0.615) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin_ratio -0.2))
(pad 17 smd rect (at -0.3075 0.3075) (size 0.615 0.615) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin_ratio -0.2))
(pad 17 smd rect (at -0.3075 -0.3075) (size 0.615 0.615) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin_ratio -0.2))
(model Housings_DFN_QFN.3dshapes/QFN-16-1EP_3x3mm_Pitch0.5mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
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